(0.50 mm) .0197" qth series qth pins per row no. of pairs plating option C030, C060, C090 (60 total pins per bank = Cd) C020, C040, C060 (20 pairs per bank = CdCdp) Cf = gold flash on signal pins and ground plane, matte tin on tails Cl = 10 " (0.25 m) gold on signal pins and ground plane, matte tin on tails Cc* = electro-polished selective 50 " (1.27 m) min au over 150 " (3.81 m) ni on signal pins in contact area, 10 " (0.25 m) min au over 50 " (1.27 m) ni on ground plane in contact area, matte tin over 50 " (1.27 m) min ni on all solder tails Cd = single-ended CdCdp = differential pair (C01 only) lead style type a other option Ck = (7.00 mm) .275" dia polyimide flm pick & place pad (n/a with -05 & -07 lead style) Ctr = tape & reel (C090 positions maximum) Cl = latching option (C01 lead style only) (n/a on C060 (CdCdp) & C090) specify lead style from chart f-217 high-speed ground plane header qth lead style a height with qsh* C01 (4.27) .168 (5.00) .197 C02 (7.26) .286 (8.00) .315 C03 (10.27) .404 (11.00) .433 C04 (15.25) .600 (16.00) .630 C05 (18.26) .718 (19.00) .748 C07 (24.24) .954 (25.00) .984 C09 (13.26) .522 (14.00) .551 *processing conditions will affect mated height. see so series for board space tolerances (20.00) .7875 ?dp = (no. of p airs per ro w/20) x (20.00) .7875 ?d = (no . of pins per ro w/30) x (20.00) .7875 (0.20) .008 (0.50) .0197 01 02 (7.11) .280 (0.76) .030 (0.64) .025 a a (0.89) .035 dia C01 & C02 C03 thru C09 Cl *note: Cc plating passes 10 year mfg testing note: some lengths, styles and options are non-standard, non-returnable. for complete specifcations and recommended pcb layouts see www.samtec.com?qth insulator material: liquid crystal polymer terminal material: phosphor bronze plating: au or sn over 50 " (1.27 m) ni current rating: contact: 2 a per pin (1 pin powered per row) ground plane: 25 a per ground plane (1 ground plane powered) operating temp range: -55 c to +125 c voltage rating: 125 vac (5 mm stack height) max cycles: 100 rohs compliant: ye s specifications for complete scope of recognitions see www.samtec.com/quality recognitions protocols processing ? 100 gbe ? hypertransport ? ? xaui ? pci express ? ? s ata ? infniband ? leadCfree solderable: ye s smt lead coplanarity: (0.10 mm) .004" max (030-060) (0.15 mm) .006" max (090) board stacking: for applications requiring more than two connectors per board contact ipg@samtec.com gbps 2 5 high-speed channel performance qth/qsh @ 5 mm mated stack height rating based on samtec reference channel. for full si performance data visit samtec.com or contact sig@samtec.com file no. e111594 file no: 090871_0_000 ex tended life pr oduc t 10 year mfg with 50 " gold high ma ting cycles board mates: qsh cable mates: hqcd, hqdp (see also available note) standoffs: so also available (moq required) ? 15 mm, 22 mm and 30 mm stack height ? 30 " (0.76 m) gold (specify -h plating for data rate cable mating applications.) ? edge mount & guide posts ? 80 (-dp), 120, 150 positions per row ? retention option contact samtec . ? qthC030C01ClCdCa qthC060C07CfCdCa qthC090C01CcCdCa standard stack heights from 5 mm to 25 mm integral metal plane for power or ground www.samtec.com due to technical progress, all designs, specifcations and components are subject to change without notice.
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